PART |
Description |
Maker |
21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm 封装外形12,16蜇薄QFN3x3x0.8mm
|
Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
|
21-0147C |
PACKAGE OUTLINE 6L UDFN 1.5 X 1.0 X 0.8mm
|
MAXIM - Dallas Semiconductor
|
PL00123-WCA02 |
Flat lens package 2.0 x 1.25 x 0.8mm
|
P-tec Corporation
|
18-038-RSGHBHC1-S01-2T |
Package in 8mm tape on 7?diameter reel
|
Everlight Electronics Co., Ltd
|
19-21-R6C-AL2N1VY-3T |
0603 Package Chip LED(0.8mm Height)
|
Everlight Electronics Co., Ltd
|
19-21-Y2C-CP1Q2B-3T |
0603 Package Chip LED (0.8mm Height)
|
Everlight Electronics Co., Ltd
|
19-21SURC-S530-A3-TR8 |
0603 Package Chip LED(0.8mm Height)
|
Everlight Electronics Co., Ltd
|
17-215-S2C-AQ1R2B-3T |
0805 Package Chip LED (0.8mm Height)
|
Everlight Electronics Co., Ltd
|
LTST-108KRKT |
ROHS/ Package in 8mm tape on 7?diameter reels
|
Lite-On Technology Corporation
|
17-215-G6C-FN2P2B-3T |
0805 Package Chip LED (0.8mm Height)
|
Everlight Electronics Co., Ltd
|
BL-LS5050A1S3 BL-LS5050A1S3PGC BL-LS5050A1S3UBC BL |
5.5mmx5.0mm SMD, 1.8mm THICKNESS PLCC6 package
|
BetLux Electronics
|